PCB copper plating (horizontal, vertical)
Acid electrolytic copper plating is an important link in the PCB hole process. With the rapid development of microelectronics technology, printed circuit board manufacturing is more and more inclined to multi-layer, lamination, functionalization and integration. It promotes the design of printed circuits to use a large number of tiny holes, narrow pitches, and thin wires, thereby increasing the difficulty of printed circuit board manufacturing technology, especially the aspect ratio of through holes in multilayer boards exceeds 5:1 and the use of a large number of laminates in laminates. Due to the deep blind holes, the conventional vertical electroplating process cannot meet the technical requirements of high-quality and reliable interconnect holes, so the horizontal electroplating technology came into being.
It can be used for circuit boards (PCB), copper clad laminates (CCL), etc., and is widely used in emerging horizontal and vertical copper plating industries such as home appliances, communications, and computing (3C) industries.
PCB horizontal reverse pulse copper plating
As the design requirements of circuit boards tend to be thin wire diameter, high density, small hole diameter (high aspect ratio, even micro through holes), filling blind holes, traditional DC electroplating is becoming more and more incapable of meeting the requirements, especially in the case of through holes. For the plating layer in the center of the aperture of the hole electroplating, the copper layer at both ends of the aperture is usually too thick but the central copper layer is insufficient. The non-uniformity of the coating will affect the effect of current delivery and directly lead to poor product quality. In order to solve these problems, it is necessary to adopt the reverse pulse plating process.
Electrolysis process parameters:
|H2SO4 : 50-200g/L, CuSO4/5H2O : 100-350g/L
|Forward Current Density
|Reverse Current Density
|3 times forward
|Special iridium titanium anode
PCB Vertical Continuous DC Copper Plating
In the PCB vertical continuous DC copper plating process, it is required that the anode can not only meet the life requirements, but also consume as little organic additives as possible to reduce the cost of chemical consumption. Although the traditional iridium series titanium anode can meet the requirements of service life, the consumption of brightener is very large. To this end, Zhongrui Guoneng (Dongguan) Co., Ltd. has improved the process and formula of traditional iridium-based titanium anodes, so that the dedicated PCB-level copper-plated titanium anodes that reduce the consumption rate of organic additives can also meet the requirements of service life.
Typical electrolysis process parameters:
|H2SO4 : 50-100g/L, Cu : 60-120g/L, CI- : 40-55ppm
|Iridium Titanium Anode for Anode Types Over 1 Year
|Good electroplating uniformity, long life, energy saving and high current density.
Compared with conventional anodes for electroplating
1. Low cell voltage and low energy consumption
2. The rate of electrode loss is small and the size is stable
3. The electrode has good corrosion resistance, and the insolubility does not pollute the bath, making the performance of the coating more reliable.
4. The titanium anode adopts a new type of material and structure, which greatly reduces its weight and facilitates daily operation
5. Long service life, and the substrate can be reused, saving costs
The oxygen evolution overpotential is about 0.5V lower than that of the lead alloy insoluble anode, which reduces the cell voltage and reduces energy consumption.
Electrochemical performance and life test (reference standard HG/T2471-2007 Q/CLTN-2012)
|Intensive weightlessness mg
|Oxygen Evolution Potential